Functional joining of dissimilar materials using directed self-assembly of nanoparticles by capillary-bridging
The R & D project HyperConnect is a 36-months EU cooperative research project started in 2013, funded by the European Commission under the 7th Framework Programme (FP7) in the area of nanosciences, nanotechnologies, materials and new production technologies (NMP) under Grant Agreement no. FP7-NMP-310420.
The worldwide economy and society were and are benefiting heavily from the miniaturization of electronic devices enabling a myriad of novel smart products with additional functionality in the consumer and high-performance sector at ever decreasing cost. Miniaturization (Moore's law) has been the main driver for this trend in the last decades. One possible approach to support further device miniaturization is the so called 3D chip stacking. Thereby, individual semiconductor dies are stacked on top of each other and are electrically connected. A major challenge today, and therefore a limitation, is the reliable joining of dissimilar materials supporting efficient heat dissipation and sufficiently small electrical interconnect pitches within and to the chip stack. HyperConnect addresses all these challenges by a radically new method to join dissimilar materials and specifically form superior thermal and electrical joints. A novel sequential joint formation methodology decouples dependencies between material properties up till now considered as limiting factors in electronic packaging. It also enables the neck formation of functional nanoparticles by directed self-assembly using capillary-bridging between point contacts of filler particles in a matrix or between interconnects and pads. The combination of both methods yields the unprecedented joint properties.